- All sections
- B - Performing operations; transporting
- B23K - Soldering or unsoldering; welding; cladding or plating by soldering or welding; cutting by applying heat locally, e.g. flame cutting; working by laser beam
- B23K 1/08 - Soldering by means of dipping in molten solder
Patent holdings for IPC class B23K 1/08
Total number of patents in this class: 215
10-year publication summary
|
20
|
21
|
9
|
21
|
21
|
17
|
6
|
14
|
12
|
2
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Senju Metal Industry Co., Ltd. | 654 |
43 |
| Illinois Tool Works Inc. | 11152 |
20 |
| Mitsubishi Electric Corporation | 43934 |
14 |
| ERSA GmbH | 92 |
14 |
| Pillarhouse International Limited | 10 |
7 |
| Omron Corporation | 6968 |
6 |
| Fuji Corporation | 2924 |
6 |
| Abbott Cardiovascular Systems, Inc. | 1117 |
5 |
| Alpha Assembly Solutions Inc. | 189 |
5 |
| Flex Ltd. | 223 |
5 |
| International Business Machines Corporation | 60644 |
4 |
| Panasonic Corporation | 20786 |
4 |
| Fujitsu Ten Limited | 506 |
4 |
| Linde Aktiengesellschaft | 1600 |
4 |
| Nordson Corporation | 1246 |
4 |
| Tanigurogumi Corporation | 10 |
4 |
| Robert Bosch GmbH | 40953 |
2 |
| Tyco Electronics (shanghai) Co. Ltd. | 759 |
2 |
| Fuji Machine Mfg. Co., Ltd. | 982 |
2 |
| Goertek Inc. | 2477 |
2 |
| Other owners | 58 |